Low-Cost, High Throughput EB Lithography Tool Supports Ultrafine Pattern Fabrication for Diverse Substrates
The F5113 is an electron-beam lithography system supporting 200mm and 3-inch through to 6-inch substrates, making it an optimal tool for processing advanced LSIs, compound semiconductor wafers, magnetic heads, smart power devices, photonics devices, MEMS, and other devices requiring ultrafine-pitch fabrication.
The F5113's character projection (CP) functionality offers high resolution, excellent pattern fidelity, and high throughput. High-speed pattern exposure with CP enables a broad range of applications, including materials R&D and evaluation.
Advantest's proprietary self-cleaning technology massively improves the stability of the electron beam used by the F5113, contributing to higher utilization ratios and lower customer running costs across the spectrum of applications
- Can be easily adjusted to handle diverse substrates (inquire for details)
- High accuracy, high throughput
- Self-cleaning functionality
| Supported Substrates | 200mm, 3-inch to 6-inch |
|---|---|
| Beam Acceleration Voltage | 50kV |
| Lithography Methods | CP, VSB |
| Reduction Ratio of CP Projection | 60x |
| Supported Nodes | 90nm and below (Smallest node supported varies by application. Inquire for details.) |
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